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Microvias : for low-cost, high-density interconnects [electronic resource] / John H. Lau, S.W. Ricky Lee.

Lau, John H. (Author). Lee, S. W. Ricky. (Added Author).
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Electronic resources

Subject: Microelectronic packaging.
Multichip modules (Microelectronics)
Flip chip technology.
Printed circuits.
Drilling and boring.
Micro-drilling.
Microelectronics > Materials.
Solder and soldering.
Solder and soldering > Testing.
Microelectronics packaging > Reliability.
Multichip modules (Microelectronics) > Testing.
Integrated circuits > Design and construction > Cost control.
Semiconductors > Junctions.
Genre: Electronic books.
Internet resources.

Record details

  • ISBN: 0071455795
  • ISBN: 9780071363273
  • Physical Description: 1 electronic text (xxiii, 565 p.) : ill.
  • Publisher: New York : McGraw-Hill, [2001]

Content descriptions

General Note: Print version c2001.
Bibliography, etc. Note: Includes bibliographic references and index.
Formatted Contents Note: http://www.loc.gov/catdir/toc/mh031/2001030752.html
Additional Physical Form available Note: Also issued in print and PDF version.
Biographical or Historical Data: Contributor biographical information: http://www.loc.gov/catdir/bios/mh041/2001030752.html
Source of Description Note: Description based on cover image and table of contents, viewed on April 25, 2007.

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