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Introduction to system-on-package (SOP) [electronic resource] : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan.

Tummala, Rao R., 1942- (Author). Swaminathan, Madhavan. (Added Author). Bandyopadhyay, Tapobrata. (Added Author). Mehendale, Mahesh. (Added Author). Rao, Jagdish. (Added Author). Lee, Baik-Woo. (Added Author). Yoon, Chong K. (Added Author). Brown, Kenneth M. (Added Author). Engin, A. Ege. (Added Author). Govind, Vinu. (Added Author). Bavisi, Amit. (Added Author). Papapolymerou, John. (Added Author). Tentzeris, Manos. (Added Author). Laskar, Joy. (Added Author). Bhattacharya, Swapan. (Added Author). Chang, Gee-Kung. (Added Author). Gaylord, Thomas. (Added Author). Vallalaz, Ricardo. (Added Author). Guidotti, Daniel. (Added Author). Chen, Ray T. (Added Author). Sundaram, Venky. (Added Author). Liu, Fuhan. (Added Author). Krishnan, Ganesh. (Added Author). White, George. (Added Author). Kohl, Paul. (Added Author). Raj, P. Markondeya. (Added Author). Pucha, Raghuram V. (Added Author). Qu, Jianmin. (Added Author). Sitaraman, Suresh K. (Added Author). Monajemi, Pejman. (Added Author). Ayazi, Farrokh. (Added Author). Sparks, Douglas. (Added Author). Zhang, Zhuqing. (Added Author). Li , Y. (Added Author). Wong, C. P. (Added Author). Joshi, Y. (Added Author). Jha, Gopal C. (Added Author). Patterson, M. (Added Author). Dutta, P. (Added Author). Akbay, S. S. (Added Author). Keezer, D. (Added Author). Chatterjee, A. (Added Author). Janagama, Dasharathan G. (Added Author). Liu, Jin. (Added Author). Iyer, Mahadevan K. (Added Author).
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Electronic resources

Subject: Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Genre: Electronic books.
Internet resources.

Record details

  • ISBN: 0071603158
  • ISBN: 9780071459068
  • Physical Description: 1 electronic text (xx, 785 p.) : ill.
  • Publisher: New York : McGraw-Hill, [2008]

Content descriptions

General Note: Print version c2008.
Bibliography, etc. Note: Includes bibliographical references and index.
Additional Physical Form available Note: Also issued in print and PDF version.
Source of Description Note: Description based on cover image and table of contents, viewed on October 21, 2008.
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020 . ‡a9780071459068
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1001 . ‡aTummala, Rao R., ‡d1942-
24510. ‡aIntroduction to system-on-package (SOP) ‡h[electronic resource] : ‡bminiaturization of the entire system / ‡cRao R. Tummala, Madhavan Swaminathan.
2461 . ‡iOnline index title: ‡aSystem on package: miniaturization of the entire system
260 . ‡aNew York : ‡bMcGraw-Hill, ‡c[2008]
300 . ‡a1 electronic text (xx, 785 p.) : ‡bill.
4901 . ‡aMcGraw-Hill's AccessEngineering
500 . ‡aPrint version c2008.
504 . ‡aIncludes bibliographical references and index.
530 . ‡aAlso issued in print and PDF version.
588 . ‡aDescription based on cover image and table of contents, viewed on October 21, 2008.
650 0. ‡aMultichip modules (Microelectronics) ‡xDesign and construction.
650 0. ‡aMicroelectronic packaging.
655 0. ‡aElectronic books.
655 0. ‡aInternet resources.
7001 . ‡aSwaminathan, Madhavan.
7001 . ‡aBandyopadhyay, Tapobrata.
7001 . ‡aMehendale, Mahesh.
7001 . ‡aRao, Jagdish.
7001 . ‡aLee, Baik-Woo.
7001 . ‡aYoon, Chong K.
7001 . ‡aBrown, Kenneth M.
7001 . ‡aEngin, A. Ege.
7001 . ‡aGovind, Vinu.
7001 . ‡aBavisi, Amit.
7001 . ‡aPapapolymerou, John.
7001 . ‡aTentzeris, Manos.
7001 . ‡aLaskar, Joy.
7001 . ‡aBhattacharya, Swapan.
7001 . ‡aChang, Gee-Kung.
7001 . ‡aGaylord, Thomas.
7001 . ‡aVallalaz, Ricardo.
7001 . ‡aGuidotti, Daniel.
7001 . ‡aChen, Ray T.
7001 . ‡aSundaram, Venky.
7001 . ‡aLiu, Fuhan.
7001 . ‡aKrishnan, Ganesh.
7001 . ‡aWhite, George.
7001 . ‡aKohl, Paul.
7001 . ‡aRaj, P. Markondeya.
7001 . ‡aPucha, Raghuram V.
7001 . ‡aQu, Jianmin.
7001 . ‡aSitaraman, Suresh K.
7001 . ‡aMonajemi, Pejman.
7001 . ‡aAyazi, Farrokh.
7001 . ‡aSparks, Douglas.
7001 . ‡aZhang, Zhuqing.
7001 . ‡aLi , Y.
7001 . ‡aWong, C. P.
7001 . ‡aJoshi, Y.
7001 . ‡aJha, Gopal C.
7001 . ‡aPatterson, M.
7001 . ‡aDutta, P.
7001 . ‡aAkbay, S. S.
7001 . ‡aKeezer, D.
7001 . ‡aChatterjee, A.
7001 . ‡aJanagama, Dasharathan G.
7001 . ‡aLiu, Jin.
7001 . ‡aIyer, Mahadevan K.
74002. ‡aIntroduction to the system-on-package (SOP) technology.
74002. ‡aIntroduction to system-on-chip (SOC).
74002. ‡aStacked ICS and packages (SIP).
74002. ‡aMixed-signal (SOP) design.
74002. ‡aRadio frequency systemon-package (RF SOP).
74002. ‡aIntegrated chip-to-chip optoelectronic SOP.
74002. ‡aSOP substrate with multilayer wiring and thin-film embedded components.
74002. ‡aMixed-signal (SOP) reliability.
74002. ‡aMEMS packaging.
74002. ‡aWafer-level SOP.
74002. ‡aThermal SOP.
74002. ‡aElectrical test of SOP modules and systems.
74002. ‡aBiosensor SOP.
830 0. ‡aMcGraw-Hill's AccessEngineering.
85640. ‡uhttp://proxy.library.upei.ca/login?url=http://accessengineeringlibrary.com/browse/system-on-package-miniaturization-of-the-entire-system ‡yFull text via AccessEngineering
902 . ‡a20140916acc ‡bAccessEngineering
949 . ‡aTK 7870.15 .T86 ‡wLC ‡c1 ‡i230187-2001 ‡d7/16/2012 ‡lMAIN ‡mMGH ‡q5 ‡rY ‡sY ‡tWEB ‡u10/21/2008 ‡xENG
997 . ‡a(c)2008 Cassidy Cataloguing Services, Inc.
901 . ‡accn00230187 ‡bSystem Local ‡c1208767 ‡tbiblio
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